BERGQUIST GAP PAD TGP EMI1000 Így ismerik: Gap Pad® EMI 1.0

BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating. Options and Configurations Standard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" Custom made configurations available upon request

• Thermal Conductivity: 1.0 W/m-K
• Electromagnetic Interference (EMI) absorbing
• Fiberglass reinforced for puncture, shear and tear resistance
• Highly conformable, low hardness

Color	Black
Density	2.4 g/cm³
Dielectric Breakdown Voltage	1700.0 Vac
Dielectric Constant, @ 1kHz	6.0
Flame Rating	V-0
Heat Capacity, ASTM E1269	1.3 J/g-K
Operating Temperature	-60.0 - 200.0 °C
Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00	5.0
Standard Thickness	0.508 - 3.175 mm
Thermal Conductivity	1.0 W/mK
Volume Resistivity	1×10 Ohm m