BERGQUIST GAP PAD TGP HC1000 Így ismerik: Gap Pad® HC1000

BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.

• Thermal Conductivity: 1.0 W/m-K
• “Gel-like” modulus
• Fiberglass reinforced for puncture, shear and tear resistance
• Highly Conformable, low hardness

Carrier Type	Fiberglass
Color	Gray
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.254 - 0.508 mm
Technology	Silicone
Thermal Conductivity	0.1 W/mK
Young's Modulus, ASTM D575	275.0 KPa (40.0 psi )