BERGQUIST GAP PAD TGP HC5000 Így ismerik: Gap Pad® HC 5.0

BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications. BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling.

• Silicone-based
• Fiberglass reinforced for shear and tear resistance
• Thermal conductivity: 5 W/m-K
• High compliance, low compression stress

Carrier Type	Fiberglass
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 °C
Technology	Silicone
Thermal Conductivity	5.0 W/mK
Young's Modulus, ASTM D575	121.0 KPa (17.5 psi )