BERGQUIST LIQUI FORM TLF 6000HG

BERGQUIST LIQUI FORM TLF 6000HG is a silicone-based, thermally conductive, and pre-cured gel interface material specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity. BERGQUIST® LIQUI FORM TLF 6000HG is a unique formula that effectively provides electronic component cooling capability for remote antenna assembly and 5G base stations where reliability in vertical gap stability is required. The pre-cured gel doesn’t require mixing or refrigeration and is ideal for filling narrow gaps that measure

• Thermal conductivity: 6.0 W/m-K
• Dispensable pre-cured gel
• Stable viscosity in storage and in the application
• Excellent chemical stability and mechanical stability