LOCTITE ABLESTIK 8700K

LOCTITE ABLESTIK 8700K, Epoxy, Die attach LOCTITE ABLESTIK 8700K adhesive provides excellent adhesion to thin film and thick film gold surfaces. This adhesive retains its dispensed height after cure, without slumping. Please refer to the TDS for alternate cure schedules.

• Non-conductive
• Excellent adhesion

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	20.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	55.0 ppm/°C
Color	White
Cure Schedule, @ 175.0 °C	1.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	165.0 °C
RT Die Shear Strength, 2 x 2 mm on Gold	5000.0 kg-f
Thermal Conductivity	0.5 W/mK
Viscosity, @ 25.0 °C	45000.0 mPa·s (cP)
Volume Resistivity	3x10¹⁴ Ohm cm