LOCTITE ABLESTIK 8900NC Így ismerik: ABLEBOND 8900NC (6.5G)

LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size, aspect ratio and package design.

• Snap curable
• Fast cure
• High strength
• Non-conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	162.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
Glass Transition Temperature (Tg)	19.0 °C
RT Die Shear Strength	13.0 kg-f
Tensile Modulus, DMTA @ 250.0 °C	62.0 N/mm² (9000.0 psi )
Thermal Conductivity	0.3 W/mK
Thixotropic Index	5.9
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	10000.0 mPa·s (cP)