LOCTITE 3508NH

LOCTITE 3508NH, Epoxy, Underfill LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser

• Reflow curable
• Halogen free
• Eliminates post-reflow dispenses and cure steps
• Reworkable

Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	175.0 ppm/°C
Glass Transition Temperature (Tg)	118.0 °C
Viscosity, Cone & Plate, @ 25.0 °C	70000.0 mPa·s (cP)