LOCTITE 3517M

LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications.

• One component - requires no mixing
• Reworkable
• Low halogen content

Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	191.0 ppm/°C
Cure Schedule Light Intensity	30.0 mW/cm²
Cure Schedule, Recommended @ 120.0 °C	5.0 min.
Glass Transition Temperature (Tg)	78.0 °C
Viscosity, Haake PK1.2	2600.0 mPa·s (cP)