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LOCTITE ECCOBOND E 1172 A

LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical. LOCTITE® ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
  • Void free underfill
  • Single component
  • Long pot life
  • Fast Cure

Cure Schedule, @ 135.0 °C 6.0 min.
Glass Transition Temperature (Tg) 135.0 °C
Viscosity, Brookfield, Spindle 3, speed 5 rpm 17000.0 mPa·s (cP)