LOCTITE ECCOBOND E 1216M

LOCTITE ECCOBOND E 1216M, Epoxy, Underfill LOCTITE® ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products.

• High Tg
• Fast, void-free underfill of area array devices
• Snap curable
• Excellent stability during shipping, storage and use

Coefficient of Thermal Expansion (CTE), Above Tg	131.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	35.0 ppm/°C
Glass Transition Temperature (Tg)	125.0 °C
Viscosity, Brookfield, Spindle 4, speed 20 rpm	4000.0 mPa·s (cP)
Work Life	5.0 day