LOCTITE ECCOBOND FP4526

LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.

• Excellent wettability
• Excellent adhesion
• Low viscosity
• Fast flow

Coefficient of Thermal Expansion (CTE), Above Tg	101.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	33.0 ppm/°C
Cure Schedule, @ 165.0 °C	15.0 min.
Flexural Modulus	8500.0 N/mm² (1232500.0 psi )
Glass Transition Temperature (Tg)	133.0 °C
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm	4700.0 mPa·s (cP)