LOCTITE ECCOBOND FP4530

LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.

• Compatible with small gap sizes
• Snap curable
• For flip chip on flex applications with a 25 ?m gap
• Material color will change from blue to green when cured

Coefficient of Thermal Expansion (CTE), Above Tg	150.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	46.0 ppm/°C
Cure Schedule, @ 160.0 °C	7.0 min.
Glass Transition Temperature (Tg)	145.0 °C
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 20 rpm	3500.0 mPa·s (cP)