Product details from catalogue Inquiry

Drawings:

LOCTITE ECCOBOND FP4531

LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap. LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
  • Snap curable
  • Fast flow
  • Passes NASA outgassing

Flexural Modulus 7600.0 N/mm² (1102000.0 psi )