LOCTITE ECCOBOND UF 3513HF

LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.

• Halogen-free
• One component for easy processing
• Fast cure at moderate temperatures
• Good adhesion to a variety of substrates

Coefficient of Thermal Expansion (CTE), Above Tg	197.7 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	60.4 ppm/°C
Cure Schedule, @ 80.0 °C	30.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	75.0 °C
Pot Life	3.0 day
Storage Temperature	2.0 - 8.0 °C
Technology	Epoxy
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm	3300.0 mPa·s (cP)