LOCTITE ECCOBOND UF 3808

LOCTITE ECCOBOND UF 3808, Epoxy, Underfill LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

• High Tg
• Reworkable
• Low CTE
• Room temperature flow capability

Coefficient of Thermal Expansion (CTE), Above Tg	171.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	55.0 ppm/°C
Cure Schedule, @ 130.0 °C	8.0 min.
Glass Transition Temperature (Tg)	113.0 °C
Viscosity, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹	360.0 mPa·s (cP)