LOCTITE ECCOBOND UF 3810

LOCTITE ECCOBOND UF 3810, Epoxy, Underfill LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

• Fast cure at moderate temperatures
• Halogen free
• High Tg
• Compatible with most Pb-free solders

Coefficient of Thermal Expansion (CTE), Above Tg	171.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	55.0 ppm/°C
Cure Schedule, @ 130.0 °C	8.0 min.
Glass Transition Temperature (Tg)	102.0 °C
Viscosity, Cone & Plate, @ 25.0 °C Shear Rate 20 s⁻¹	394.0 mPa·s (cP)
Work Life	3.0 day