LOCTITE ECCOBOND UF 3811

LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

• Room temperature flow capability
• Low viscosity material flows at room temperature with no additional preheating required
• High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
• Cures quickly at moderate temperatures to minimize stress to other components

Coefficient of Thermal Expansion (CTE), Above Tg	190.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	61.0 ppm/°C
Cure Schedule, @ 100.0 °C	60.0 min.
Glass Transition Temperature (Tg)	124.0 °C
Viscosity, Brookfield, Physica @ 25.0 °C Spindle CP50-1, Speed 20 rpm	354.0 mPa·s (cP)