LOCTITE ECCOBOND UF 3812

LOCTITE ECCOBOND UF 3812, Halogen-free, Reworkable, Low viscosity, Fast cure, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.

• Halogen-free
• Low viscosity material flows at room temperature with no additional preheating required
• High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
• Room temperature flow capability

Applications	Encapsulating, Underfilling
Coefficient of Thermal Expansion (CTE), Above Tg	175.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	48.0 ppm/°C
Color	Black
Cure Schedule, @ 130.0 °C	10.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	131.0 °C
Pot Life	3.0 day
Storage Modulus, DMA @ 25.0 °C 3-point bending	3004.0 N/mm² (435580.0 psi )
Storage Temperature	-20.0 °C
Technology	Epoxy
Viscosity, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹	350.0 mPa·s (cP)
Work Life	1.0 day