LOCTITE ABLESTIK ABP 2032S Így ismerik: ABP 2032S (17G)

LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.

• Good adhesion
• Low temperature cure
• Electrically conductive
• Good dispensing characteristics

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	54.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	29.0 ppm
Extractable Ionic Content, Potassium (K+)	19.0 ppm
Extractable Ionic Content, Sodium (Na+)	19.0 ppm
RT Die Shear Strength	16.0 kg-f
Substrates	LeadFrame: Gold
Tensile Modulus, DMA @ 250.0 °C	150.0 N/mm² (21755.0 psi )