LOCTITE ABLESTIK ABP 2035SCR

LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.

• Non-conductive
• Single component
• Fast cure
• Low cure temperature

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	50.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	135.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	118.0 °C
Thermal Conductivity	1.0 W/mK
Thixotropic Index	4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9830.0 mPa·s (cP)