LOCTITE ABLESTIK ABP 2100AC Így ismerik: ABP-2100AC (35g)

LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able towithstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.

• Low stress
• Low cost

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Cure Type	Heat Cure