BERGQUIST SIL PAD TSP Q2500 Így ismerik: Q-Pad® II

BERGQUIST SIL PAD TSP Q2500, Aluminum-foil substrate, Silicone based Grease Replacement for Maximum Heat Transfer BERGQUIST® SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds. BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.

• Thermal impedance: 0.22°C-in2/W (@50 psi)
• Maximum heat transfer
• Designed to replace thermal grease
• Aluminum foil coated both sides

Color	Pink
Operating Temperature	-60.0 - 180.0 °C
Technology	Silicone
Thermal Conductivity	1.2 W/mK